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POM, VIA!

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POM is EPF Elettrotecnica’s solution dedicated to automatic packaging of apples. It stands out for being a modular and flexible solution, easily integrated to existing production lines.

The goal of POM, VIA! project is to bring POM technology to higher technology readiness level, preparing it to commercialization.

Hardware and software completion will take place through the introduction of Artificial Intelligence (AI) innovative technologies applied to visual processing systems and use of new technologies for images acquisition in three-dimensional digital format. Thanks to these advanced solutions, all the operations required for apple packaging market will be guaranteed.

POM, VIA! achieves the goals by choosing the optimal tools. Indeed, the detection of the development framework and industrial use in real-time of AI applications is fundamental today both for the correct use of the technologies available on the market, and to strategically develop the skills and know-how to have an advantage on the market in the near future.

In general, these developments are part of the growing convergence trend of the IT (Information Technology) and OT (Operational Technology) worlds in the field of 4.0 technologies.

The POM, VIA! project continues the technological maturation of the POM and the methodologically structured development of a framework for present and future challenges.

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